Hentech PCB is a leading supplier of cutting-edge printed circuit board manufacturing technology, providing the electronics industry with the highest standards of quality. Our unwavering commitment to technological leadership drives us to continually innovate and address new design challenges.
Our state-of-the-art innovation labs and expert engineering teams specialize in overcoming complex design obstacles, including:
◕ High-speed, high-capacity circuits
◕ RF and microwave technologies
◕ Thermal management solutions
◕ Miniaturization technologies
◕ Chip packaging substrates
We provide customized solutions for a wide range of industries, covering 5G, AI robotics, battery management systems (BMS), and more. Our technical capabilities cover:
◕ HDI PCBs (Blind Buried Vias)
◕ Up to 100 Layer Multilayer PCBs
◕ Rigid-Flex PCBs
◕ RF PCBs (Rogers, Taconic ……)
◕ Thick Copper PCBs
◕ Flexible PCBs
PCB welcomes the submission of complex RFQs for cost estimation. We are proud to have our products UL listed:
◕ Rigid PCB/Aluminum PCB: E472163
◕ Flexible PCB/Rigid-Flex PCB: E544606
Trust Hentech PCB to meet your advanced PCB manufacturing needs with precision, quality and innovation.
The overall composition of a PCB depends on the project requirements. The substrate of the board is made up of multiple layers of material and is wired with copper foil. Before starting any component assembly, the assembler must review the design documents and evaluate any potential faults in the PCB that could affect performance.
How the unit is assembled depends on which of two mounting methods is used: surface mount or through-hole assembly.
Today, most printed circuit boards are assembled using surface mount technology (SMT). Surface mount technology allows for smaller, more compact component packaging, and reduces production time and overall costs.
Whether you’re looking for prototyping, low-volume trial production, or high-volume deliveries, our manufacturing partnerships provide the precision and flexibility to respond to your PCB requirements.
With a global manufacturing network, we are able to utilize a wide range of materials and advanced processes to produce complex multi-layer structures ranging from single-sided and double-sided boards to high-density interconnects (HDIs) and sequence building units (SBUs). Whether it’s a project with special requirements for mechanical and thermal properties, material types, or a design with high functional density, we offer reliable solutions.
Our resources allow for a seamless transition from rapid prototyping to mass production, with a range of layers from 1 to 64, ensuring high quality and efficient support at every stage of your project.
In PCB assembly, choosing the right production process is critical to both product performance and cost control. Surface mount technology (SMT) offers higher production efficiencies and is particularly suited to smaller electronic products that require compact layouts. This technology is able to support smaller component arrangements and is the mainstream choice for modern commercial electronics manufacturing.
In contrast, through-hole assembly, while slightly slower in terms of production speed, offers significant advantages in terms of connection robustness and long-term reliability, and is particularly suitable for devices operating in extreme environments. For this reason, military, aerospace, and other sectors with stringent stability requirements often utilize the through-hole process.
Hentech offers both SMT and through-hole assembly capabilities. Based on your product requirements, budget, and operating environment, we will evaluate and recommend the most appropriate production method to help you realize your design in the most cost-effective way.
Ready to get started? Get in touch today to learn more about our surface mount circuit board assembly services and book a consultation at your convenience by filling out our request a quote form. If you don’t have design or Gerber files we’ll work with you to create a design. If you require a quick turnaround PCB quote or lead time, please let us know and we’ll work with you to accommodate your specific needs.
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+86 137 9821 9394
Sale@hengele.com
Room A, 3/F, Block 28, Chentian Industrial Area, Baotian 2nd Road, Xixiang Town, Bao'an District, Shenzhen, China
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