Placement speed: Dual beam structure with dual high-speed multi-purpose head (HM), up to 95,000 CPH (Chip Per Hour)
Placement head and component support:
HM (High-speed Multi-purpose) placement head: supports miniature components (e.g., 0201) up to 55×100mm, up to 15mm; wide scanning camera recognizes component sizes up to 12×12mm. 15mm; wide scanning camera recognizes component sizes up to 12×12mm
FM (Flexible Multi-Purpose) Placement Head: Supports non-standard component sizes from 30×15mm to 55×100mm, height ≤ 28mm
One Head for Multiple Components: The HM head can cover more than 90% of the common components without the need to change the head
Placement Accuracy and Recognition System:
Accuracy: ±0.035mm (3σ, Cpk ≥ 1.0), with limits to ±1.0mm. (3σ, Cpk ≥ 1.0), limit up to ±0.025mm
Intelligent Recognition: Equipped with wide scanning and side-view camera, realizing Flying Recognition without recognition time loss
Handles PCB sizes:
Single-track: 50×50mm to 810×490mm
Dual-track configuration, single-board same as the top or two boards up to a total of 810×662mm in width
Fixed Feeder Positions: Max. 140 *8mm tape
Trolley Feeder Position: 128 trolleys to support quick changeover
Pallet Options: Support for sATS30 system 30 pallets (stationary) or cATS10 10 pallets (cart)
Auto Loading Feeder (ALF): No interruption to tape changeover for improved productivity

Applicable stencil size: 370×470mm to 737×737mm; thickness 25-40mm
Applicable PCB size: 50×50mm to 400×340mm, support board thickness 0.4-6mm, FPC (fixture required) thickness ≤0.6mm
Pallet warping tolerance: ≤1%
Transportation height: 900 ± 40mm, support left/right direction bidirectional transport
Maximum transport speed: 1500mm/s (programmable)
Repeat positioning accuracy: ± 0.01mm
Printing accuracy: ± 0.025mm

A high-precision device specialized in solder paste quality control, widely used in SMT (surface mount technology) production lines. It ensures the accuracy of the height, width and thickness of the solder paste by means of advanced 3D inspection technology, thus improving solder quality and reducing production defects.

Main applications: Detection of under-tinning, missed prints, continuous tinning, over-tinning, misalignments, bad shapes, board contamination
Measuring principle: Digital structured grating phase modulation contouring technology
Pixels: 5M/12M

Reflow soldering equipment is designed for SMT electronic assembly, with high-precision temperature control and flexible configuration capabilities. Its core parameters include: temperature profile setting (lead-free soldering, for example) covers the preheating zone (room temperature to 150 ℃, the slope of the temperature ≤ 2 ℃ / s), constant temperature zone (150-180 ℃, 60-90 seconds), reflow zone (peak 235-245 ℃, lasting 10-20 seconds) and cooling zone (cooling rate of 3-5 ℃ / s); transfer speed adjustable range of 0.1-1.5m/min, recommended 0.8m/min suitable for most PCB boards; heating zone configuration 8 independent temperature zones, temperature control accuracy and flexible configuration capabilities. Recommended 0.8m/min suitable for most PCB boards; heating zone configuration of eight independent temperature zones, temperature control accuracy ± 1 ℃, total power 20kW.
optimization recommendations, including for high-density boards to reduce the transfer speed to 0.6m/min, heat-sensitive components to control the peak temperature of 230 ℃ or less, and regular maintenance of the chain and temperature sensors. The equipment is suitable for production in multiple scenarios from consumer electronics to automotive electronics, and the parameters need to be adjusted in accordance with product characteristics to ensure stability.