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Surface Mount PCB Assembly
In the field of electronic manufacturing, SMT (surface mount technology) is the core technology to promote the miniaturization and high performance of modern electronic products. We focus on providing high-precision, high-reliability SMT processing services to help customers realize the full range of support from design to mass production, applicable to consumer electronics, automotive electronics, medical equipment, industrial control and other fields.
Hentech is a longtime provider of surface mount PCB assembly services to customers in a variety of industries. We specialize in contract manufacturing and have extensive experience in the assembly of electronic products for a variety of applications. With abundant equipment and a professional team, we can provide you with product prototyping and testing, contract manufacturing and other services. Please read on for details or contact us directly for a quote.
How Does SMT Work?
Briefly put, SMT is a process for electronics assembly in which electronic components supplied are mounted to the surface of a printed circuit board (PCB). It’s a highly automated and flexible process that allows manufacturers to construct circuit boards with a wide variety of components.
Surface mounting has several advantages over similar PCB manufacturing techniques. Perhaps most importantly, it allows for much smaller products — up to one-third the size and one-tenth the weight of through-hole boards — and higher connection densities. SMT enables manufacturers to place increasingly complex circuits into small assemblies, so it has been a crucial factor in the proliferation of small electronic devices in everyday life.
Surface mount boards are also faster and easier to assemble and more cost-effective than boards constructed with through-hole technology. Through-hole PCB assembly is an older technology which involves attaching leads to holes drilled into the circuit board. This process creates very durable products, as these connections are quite sturdy. It can be more expensive than SMT, though, and the component density is generally higher. Our engineers can help you determine which assembly process best fits your use case.
There are four basic steps in the process of PCB SMT board design assembly:
Prepare the printed circuit board
Place the components
Reflow soldering
Inspection
In the world of electronics manufacturing, solder paste printing is like the first step to the circuit board “make-up”, this seemingly simple process, but the entire SMT placement process is the key to the success of the foundation.
Preparation is like a painter needs a canvas, we first need to prepare the PCB board, engineers will carefully design the circuit diagram to determine the location of each component.
The Magic Solder Paste This special “electronic glue” consists of two parts: tiny tin alloy particles (88-92%) and a special flux (8-12%) that is as thick as toothpaste at room temperature and melts when heated to form a strong electrical connection.
1. 1. Prepare PCB initial
2. Surface mount component placement process
After solder paste printing is completed and verified to be correct, the assembler places the electronic components in their exact counterparts on the circuit board. To facilitate automated placement, these components are often stored on reels, in tubes, or in reels. The placement equipment is equipped with vacuum nozzles or fixtures that quickly pick up the components from the package and place them precisely on the surface of the flexible printed circuit board (PCB).
Surface mount technology (SMT) utilizes a wide variety of components with different packages and pin configurations. For example, transistors and diodes are mostly packaged in small plastic packages that are suitable for high-density assembly. As for integrated circuits (ICs), the package forms are even more diverse. Simple logic devices may have only a dozen or so pins, while complex chips may have hundreds of connections. For example, Very Large Scale Integration (VLSI) chips are often packaged in rectangular packages with pins on all four sides. Another common package is the Ball Grid Array (BGA), which has the solder joints located on the bottom of the chip, helping to improve wiring efficiency and supporting the structural design of multi-layer PCBs.
3. Reflow soldering implementation process
After the placement is completed, although the solder paste can be fixed in a short period of time in the position of the electronic components, but at this time the components have not yet really with the PCB to achieve a solid connection, but also not the formation of a complete electrical pathway. To realize the final shape of the solder joint, must be through the reflow soldering process.
In a reflow oven, the board undergoes a precisely controlled heating process in which the solder paste is gradually heated to a melting temperature where it bonds to the component pins and pads to form a secure solder joint. The entire temperature profile must be tightly controlled to avoid exceeding the extreme temperatures that components can withstand, since their thermal sensitivity is close to the high temperature range required for soldering. Only with proper control can solder quality and component reliability be assured.
4. Quality Inspection Process
In the surface mount technology (SMT) process, several critical steps are taken to ensure assembly quality, often based on equipment configuration and design criteria. Prior to component placement, solder paste printing is first checked to ensure that the pattern is complete and free of defects.
Subsequently, before and after reflow soldering, inspection procedures are also performed to confirm that components are positioned accurately and solder joints are well formed to ensure that the final product meets reliability requirements.
Advantages of SMTT
There are many advantages to using surface mount technology, including the following:
Our Equipment and PCB Fabrication Capabilities
High-quality products are made with high-quality equipment. EMSG is manufacturing PCB assemblies to the IPC-A-610 standard, in both leaded and ROHS technologies. This means that our products meet the international standard for reliability and quality in printed wiring assemblies.
We offer unique manufacturing capabilities because we have invested heavily in the advanced equipment necessary to turn around complex jobs quickly and to a high standard of quality. Our equipment includes:
- Various printers for screen printing, including an MPM Accuflex
- Three Samsung SM421 machines
- A Decan F2
- A Samsung SM482
- Two machines able to populate a 4-foot continuous board
To ensure that our products meet the highest quality standards, we have introduced a number of precision inspection technologies. Using automated optical inspection (AOI) equipment, we are able to quickly identify problems during component placement, such as abnormal connection status, misplaced polarity, or malfunction, to ensure that each component is correctly installed on the board.
At the same time, we also have an in-house X-ray inspection system, which is specifically designed to inspect components such as BGAs and Micro-BGAs where the solder joints on the underside of the components are not visible, to efficiently detect hidden defects such as false soldering and bridging, thus improving soldering reliability and product stability.
One-Stop Electronic Manufacturing Service Provider
We not only specialize in the assembly of surface mount PCBs, but also provide customers with a full range of manufacturing services from component assembly to complete machine integration, testing and inspection.
Our team can assist you in designing, sourcing and installing wiring harnesses, cables and sub-modules, and assembling these components into customized enclosures. If you require pre-installation of application software, system configuration or initial setup of equipment, we can do that for you, as well as handle the final packaging and labeling.
In addition, we offer comprehensive testing and inspection solutions to ensure that every product functions properly and operates reliably. Inspection processes include manual visual inspection at high magnification, automated optical inspection (AOI), in-circuit testing (ICT), and functional testing, covering a full range of quality assurance from appearance to performance.
Adherence to High Standards of Quality Control
Hentech is headquartered in Shenzhen, Guangdong, China and specializes in providing comprehensive SMT PCB assembly services. Our 10,000+ square foot manufacturing facility is equipped with state-of-the-art production equipment and well-established workflows to ensure that every project meets strict quality control standards.
We are ISO 9001 certified and consistently follow industry-recognized best practices. By building operational processes that are traceable, scalable and monitorable, we achieve transparency and accountability throughout the manufacturing process.
Please feel free to contact us for further information on our manufacturing capabilities and quality certifications. We look forward to providing you with high quality, reliable manufacturing solutions.
Industry Sectors We Serve
We always adhere to the customer-centered approach and customize our manufacturing solutions to meet the specific needs of different projects, ensuring that every collaboration meets the customer’s expectations. As a company specializing in contract manufacturing, we have the ability to flexibly adjust our manufacturing process to quickly respond to changes in product design and process. Our core team has more than twenty years of experience in electronics manufacturing and engineering, and can provide you with professional advice on cost control, scheduling, and technology optimization.
We provide electronic assembly services to customers in a wide range of industries, including:
Medical Device Industry: We provide the medical industry with high-precision small SMT circuit boards, components that are an integral and critical part of many medical products.
Communications and Information Technology: Our services cover high-performance electronic assembly needs such as networking equipment and communication modules.
Industrial Automation & Commercial Equipment: From controllers to sensors, we provide core electronic components for a wide range of industrial and commercial systems.
Transportation & Vehicle Electronics: We support the manufacturing of in-vehicle systems, rail transportation and other transportation-related electronics.
Lighting Technology: including assembly and testing of LED driver boards and lighting control modules.
Marine & Ship Equipment: meets the high standards of reliable electronic components required for ship navigation and control systems.
Energy & Utilities: Manufacturing of electronic components such as smart grids, new energy control systems and ancillary electronic components.
Other Manufacturing Fields: Widely covering consumer electronics, test equipment and other types of electronic product assembly needs.
Regardless of the industry you come from, we are committed to providing you with high-quality, reliable electronics manufacturing services. For further information about our expertise, please feel free to contact us.
Get a Quick Quote
Ready to kick off your project? Feel free to contact us to learn more about our expertise in surface mount PCB assembly and fill out our online quote request form to schedule a time that works for you.
Even if you don’t have an existing design or Gerber file at the moment, we can assist and work with you to finalize your design blueprint. If you have an urgent need for a PCB quote or lead time, please let us know in advance and we will do our best to work with you to develop an efficient and precise solution.
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+86 137 9821 9394
Sale@hengele.com
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Room A, 3/F, Block 28, Chentian Industrial Area, Baotian 2nd Road, Xixiang Town, Bao'an District, Shenzhen, China
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